Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14184433
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Filing Dt:
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02/19/2014
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Publication #:
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Pub Dt:
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08/20/2015
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Inventors:
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Kuo-Sheng Lin, Sheng-Huang Lin
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Title:
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THERMAL MODULE ASSEMBLING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F.-3, NO. 24, WUCYUAN 2ND RD., SINJHUANG DISTRICT |
| NEW TAIPEI CITY, TAIWAN R.O.C. |
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| NIKOLAI & MERSEREAU, P.A. |
| 900 SECOND AVENUE SOUTH |
| SUITE 1550 |
| MINNEAPOLIS, MN 55402 |
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