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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	14328092	Filing Dt:	07/10/2014
Publication #:	20150235914	Pub Dt:	08/20/2015
Inventors:	Chin-Tsai Yao, Chang-Fu Lin, Ming-Chin Chuang, Fu-Tang Huang, Po-Hua Chen
Title:	FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOF

Assignment: 1

Reel/Frame:

033287/0853

Recorded: 07/10/2014

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LIN, CHANG-FU

Exec Dt:

01/27/2014

YAO, CHIN-TSAI

Exec Dt:

01/27/2014

CHUANG, MING-CHIN

Exec Dt:

01/27/2014

CHEN, PO-HUA

Exec Dt:

01/27/2014

HUANG, FU-TANG

Exec Dt:

01/27/2014

Assignee:

SILICONWARE PRECISION INDSUTRIES CO., LTD.

NO. 123, SEC. 3, DA FONG ROAD, TANTZU

TAICHUNG, TAIWAN

Correspondent:

EDWARDS WILDMAN PALMER LLP

P.O. BOX 55874

BOSTON, MA 02205

Assignment: 2

Reel/Frame:

033492/0564

Recorded: 08/07/2014

Pages: 10

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED ON REEL 033287 FRAME 0853. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE'S NAME SHOULD BE CHANGED FROM SILICONWARE PRECISIONS INDSUTRIES CO., LTD. TO SILICONWARE PRECISION INDUSTRIES CO., LTD..

Assignors:

LIN, CHANG-FU

Exec Dt:

01/27/2014