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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/16/2016
Application #:
14428696
Filing Dt:
03/17/2015
Publication #:
Pub Dt:
08/27/2015
PCT #:
US2013061722
Inventors:
Nichole Herbots, Ross Bennett-Kennett, Ashlee Murphy, Brett Hughes, Ajjya Acharya et al
Title:
Methods for Wafer Bonding, and for Nucleating Bonding Nanophases
Assignment: 1
Reel/Frame:
033996/0770Recorded: 10/21/2014Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/01/2014
Exec Dt:
10/17/2014
Exec Dt:
04/28/2014
Exec Dt:
10/17/2014
Exec Dt:
05/02/2014
Exec Dt:
06/04/2014
Exec Dt:
09/22/2014
Assignee:
1475 NORTH SCOTTSDALE ROAD
SKYSONG SUITE 200
SCOTTSDALE, ARIZONA 85257
Correspondent:
MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
300 SOUTH WACKER DRIVE
SUITE #3100
CHICAGO, IL 60606

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