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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14201452
Filing Dt:
03/07/2014
Publication #:
Pub Dt:
09/10/2015
Inventors:
James Matthew Holden, Wei-Sheng Lei, James S. Papanu, Ajay Kumar
Title:
APPROACHES FOR CLEANING A WAFER DURING HYBRID LASER SCRIBING AND PLASMA ETCHING WAFER DICING PROCESSES
Assignment: 1
Reel/Frame:
033496/0357Recorded: 08/08/2014Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/07/2014
Exec Dt:
08/07/2014
Exec Dt:
08/07/2014
Exec Dt:
08/07/2014
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085-4040

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