Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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14574405
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Filing Dt:
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12/18/2014
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Publication #:
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Pub Dt:
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09/17/2015
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Inventors:
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Hsiu-Wen Hsu, Chung-Ming Leng, Chih-Cheng Hsieh, Chun-Ying Yeh
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Title:
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PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12F., NO.368, GONGJIAN RD., XIZHI DIST., |
| NEW TAIPEI CITY, TAIWAN 22161 |
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| 6F., NO.366, GONGJIAN RD., SHI-JI DIST., |
| NEW TAIPEI CITY, TAIWAN 221 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, TAIWAN |
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