Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2016
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Application #:
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14217621
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Filing Dt:
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03/18/2014
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Publication #:
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Pub Dt:
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09/24/2015
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Inventors:
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SHAO-CHUNG HU, LING-YUEH YANG, PEN-SHAN CHAO, LOUIS LU-CHEN HSU, KUO-YANG HORNG et al
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Title:
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MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 481, CHIA AN SEC., CHUNG CHENG RD. |
| LONGTAN DIST. |
| TAOYUAN CITY 325, TAIWAN |
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| SCHMEISER, OLSEN & WATTS, LLP |
| 22 CENTURY HILL DRIVE, SUITE 302 |
| LATHAM, NY 12110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.481, JIA-AN SECTION JHONGJHENG RD., NEIGHBOR 6, |
| JIA-AN VILLAGE |
| LONGTAN TOWNSHIP, TAOYUAN COUNTY 325, TAIWAN |
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| SCHMEISER, OLSEN & WATTS |
| 22 CENTURY HILL DRIVE |
| SUITE 302 |
| LATHAM, NY 12110 |
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