Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/21/2017
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Application #:
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14687119
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Filing Dt:
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04/15/2015
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Publication #:
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Pub Dt:
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10/01/2015
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Inventors:
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Kishor DESAI, Ravinder Kachru, Vipulkumar Patel, Soham Pathak, Bipin Dama et al
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Title:
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MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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170 WEST TASMAN DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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PATTERSON & SHERIDAN |
300 N. GREENE STREET |
SUITE 2050 |
GREENSBORO, NC 27401 |
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