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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/21/2017
Application #:
14242008
Filing Dt:
04/01/2014
Publication #:
Pub Dt:
10/01/2015
Inventors:
Roden R. Topacio, Suming Hu, Yip Seng Low
Title:
SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION AND POLYMER FILM
Assignment: 1
Reel/Frame:
032685/0591Recorded: 04/16/2014Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/11/2014
Exec Dt:
04/11/2014
Exec Dt:
04/11/2014
Assignee:
1 COMMERCE VALLEY DR. EAST
KEVIN O'NEIL
MARKHAM, CANADA L3T 7X6
Correspondent:
TIMOTHY M HONEYCUTT ATTORNEY AT LAW
37713 PARKWAY OAKS LN.
MAGNOLIA, TX 77355

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