Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2017
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Application #:
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14361083
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Filing Dt:
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05/28/2014
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Publication #:
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Pub Dt:
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10/22/2015
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Inventors:
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Byung Chun LEE, Donghua JIANG, Yongyi FU, Wuyang ZHAO, Chundong LI
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Title:
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VIA-HOLE ETCHING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT |
| BEIJING, CHINA 100015 |
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| NO. 1188, HEZUO RD., (WEST ZONE), HI-TECH DEVELOPMENT ZONE |
| CHENGDU, SICHUAN, CHINA 611731 |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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