Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2019
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Application #:
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14800971
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Filing Dt:
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07/16/2015
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Publication #:
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Pub Dt:
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11/05/2015
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Inventors:
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Jui Hsieh LAI, Ying-Hao KUO, Kuo-Chung YEE
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Title:
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APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN & HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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