Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14324136
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Filing Dt:
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07/04/2014
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Publication #:
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Pub Dt:
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11/05/2015
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Inventors:
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Shiqun Gu, Ratibor Radojcic, Dong Wook Kim, Jae Sik Lee
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Title:
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INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANIC LAYERS AND REDISTRIBUTION LAYERS IN ORGANIC LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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LOZA & LOZA, LLP/QUALCOMM |
305 N. SECOND AVE., #127 |
UPLAND, CA 91786 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE SECOND INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 033515 FRAME 0559. ASSIGNOR(S) HEREBY CONFIRMS THE
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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LOZA & LOZA, LLP/ QUALCOMM |
305 N. SECOND AVE., #127 |
UPLAND, CA 91786 |
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