Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/17/2017
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Application #:
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14584428
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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11/12/2015
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Inventors:
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Yan-Heng Chen, Chung-Tang Lin, Chieh-Yuan Chi
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND CARRIER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
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