Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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14288702
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Filing Dt:
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05/28/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Inventor:
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Jer-Liang YEH
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Title:
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INGOT CUTTING METHOD CAPABLE OF REDUCING WAFER DAMAGE PERCENTAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 101, SEC. 2, KUANG-FU RD. |
| HSINCHU, TAIWAN 300 |
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| SINORICA, LLC |
| 19785 CRYSTAL ROCK DRIVE |
| SUITE 207 |
| GERMANTOWN, MD 20874 |
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