Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14758050
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Filing Dt:
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06/26/2015
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Publication #:
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Pub Dt:
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12/03/2015
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Inventors:
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Akira IRIFUNE, Mitsukazu OCHI, Natsuko ICHIKAWA, Miyuki HARADA, Takeshi KONDO et al
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Title:
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THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-3-35, YAMATE-CHO |
| SUITA-SHI, OSAKA, JAPAN 5648680 |
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| TOKYO BUILDING |
| 7-3, MARUNOUCHI 2-CHOME, |
| CHIYODA-KU, TOKYO, JAPAN 1006422 |
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| TIMIKA SNOWDEN |
| MILLEN, WHITE, ZELANO & BRANIGAN, P.C. |
| 2200 CLARENDON BLVD., SUITE 1400 |
| ARLINGTON, VA 22201 |
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