Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14759825
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Filing Dt:
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07/08/2015
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Publication #:
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Pub Dt:
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12/10/2015
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Inventors:
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Jianjun WANG, Fengfu YIN, Wei HAN, Hongtao LI, Yangchun ZHOU, Peng LIU, Shilei ZHAO et al
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Title:
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INSULATION COMPONENT AND MOLDING PROCESS FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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. |
LUDWIGSHAFEN, GERMANY 67056 |
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HI-TECH ZONE |
QINGDAO, CHINA 266101 |
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1 HAIER ROAD, QINGDAO |
SHANDONG PROVINCE, CHINA 266101 |
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OBLON, ET AL. |
1940 DUKE STREET |
ALEXANDRIA, VA 22314 |
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