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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
14731695
Filing Dt:
06/05/2015
Publication #:
Pub Dt:
12/10/2015
Inventors:
Friedjof HEUCK, Daniel Christoph MEISEL, Mirko HATTASS, Torsten KRAMER, Reinhard NEUL et al
Title:
Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure
Assignment: 1
Reel/Frame:
037655/0848Recorded: 02/03/2016Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/03/2015
Exec Dt:
06/19/2015
Exec Dt:
07/30/2015
Exec Dt:
07/29/2015
Exec Dt:
06/19/2015
Exec Dt:
06/26/2015
Exec Dt:
06/29/2015
Exec Dt:
06/15/2015
Exec Dt:
06/16/2015
Exec Dt:
06/25/2015
Assignee:
POSTFACH 30 02 20
STUTTGART, GERMANY DE-70442
Correspondent:
GERARD A. MESSINA
KENYON & KENYON LLP
ONE BROADWAY
NEW YORK, NY 10004-1007
Assignment: 2
Reel/Frame:
037704/0115Recorded: 02/05/2016Pages: 16
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE EIGHTH ASSIGNOR EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 037655 FRAME: 0848. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
07/03/2015
Exec Dt:
06/19/2015
Exec Dt:
07/30/2015
Exec Dt:
07/29/2015
Exec Dt:
06/19/2015
Exec Dt:
06/26/2015
Exec Dt:
06/29/2015
Exec Dt:
06/19/2015
Exec Dt:
06/16/2015
Exec Dt:
06/25/2015
Assignee:
POSTFACH 30 02 20
STUTTGART, GERMANY DE-70442
Correspondent:
GERARD A. MESSINA
KENYON & KENYON LLP
ONE BROADWAY
NEW YORK, NY 10004-1007

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