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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/05/2016
Application #:
14322495
Filing Dt:
07/02/2014
Publication #:
Pub Dt:
01/07/2016
Inventors:
I-Shi WANG, Ren-Dou LEE, Ting-Ying CHIEN, Jen-Hao LIU
Title:
SEMICONDUCTOR PACKAGE STRUCTURE, ALIGNMENT STRUCTURE, AND ALIGNMENT METHOD
Assignment: 1
Reel/Frame:
033248/0539Recorded: 07/07/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/23/2014
Exec Dt:
06/23/2014
Exec Dt:
06/23/2014
Exec Dt:
06/23/2014
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DRIVE, SUITE 300
PARK CITY, UT 84098

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