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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/02/2018
Application #:
14099048
Filing Dt:
12/06/2013
Publication #:
Pub Dt:
01/14/2016
Inventors:
Jan T. Jansen, Ryan Stott, William Vallellanes, Jack Van Es
Title:
Low Stress Stiffener Runout in Pi Bonded Structure
Assignment: 1
Reel/Frame:
031777/0100Recorded: 12/13/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/12/2013
Exec Dt:
12/12/2013
Exec Dt:
12/12/2013
Exec Dt:
12/12/2013
Assignee:
100 NORTH RIVERSIDE PLAZA
CHICAGO, ILLINOIS 60606-1596
Correspondent:
HOPE BALDAUFF, LLC
1175 PEACHTREE STREE, NE
100 COLONY SQUARE, SUITE 2000
ATLANTA, GA 30361

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