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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
14924151
Filing Dt:
10/27/2015
Publication #:
Pub Dt:
02/18/2016
Inventors:
Shao Ming Koh, Andy Wei, Guillaume Bouche, Jeremy A. Wahl
Title:
INTEGRATED CIRCUITS WITH DUAL SILICIDE CONTACTS AND METHODS FOR FABRICATING SAME
Assignment: 1
Reel/Frame:
036894/0218Recorded: 10/27/2015Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/27/2013
Exec Dt:
08/27/2013
Exec Dt:
08/27/2013
Exec Dt:
08/27/2013
Assignee:
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309
UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
INGRASSIA FISHER & LORENZ, P.C. (GF)
7010 E. COCHISE RD.
SCOTTSDALE, AZ 85253
Assignment: 2
Reel/Frame:
049709/0871Recorded: 07/10/2019Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/26/2018
Assignee:
303 TERRY FOX DRIVE
SUITE 300
OTTAWA, CANADA K2K 3J1
Correspondent:
ALSEPHINA INNOVATIONS INC.
1891 ROBERTSON ROAD
SUITE 100
OTTAWA, K2H 5B7 CANADA

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