Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14591044
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Filing Dt:
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01/07/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Inventor:
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Yu-Hsun Lin
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Title:
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WAFER TREATMENT SOLUTION FOR EDGE-BEAD REMOVAL, EDGE FILM HUMP REDUCTION AND RESIST SURFACE SMOOTH, ITS APPARATUS AND EDGE-BEAD REMOVAL METHOD BY USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F.-7, NO. 37, FUDE S. RD. |
| SANCHONG DIST. |
| NEW TAIPEI CITY, TAIWAN 241 |
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| DANIEL R. MCCLURE |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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