Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/13/2016
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Application #:
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14950997
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Filing Dt:
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11/24/2015
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Publication #:
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Pub Dt:
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03/17/2016
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Inventors:
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Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian
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Title:
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WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKSIDE METALLIZATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475 OAKMEAD PKWY |
| SUNNYVALE, CALIFORNIA 94085 |
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| CHEN-CHI LIN |
| 1119 QUAIL CREEK CIRCLE |
| SAN JOSE, CA 95120 |
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