Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2017
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Application #:
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14706663
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Filing Dt:
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05/07/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Inventors:
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Eun Jung LEE, Sang Jin KIM, Yong Han CHO
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Title:
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EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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150-20, GONGSE-RO, GIHEUNG-GU |
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 446-902 |
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LEE & MORSE, P.C. |
3141 FAIRVIEW PARK DRIVE |
SUITE 500 |
FALLS CHURCH, VA 22042 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAMES OF SECOND AND
THIRD INVENTORS PREVIOUSLY RECORDED ON REEL 035589 FRAME 0866. ASSIGNOR(S) HEREBY CONFIRMS THE NAMES OF SECOND AND
THIRD INVENTORS ARE EUN JUNG LEE AND YONG
HAN CHO.
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150-20, GONGSE-RO, GIHEUNG-GU |
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 446-902 |
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LEE & MORSE, P.C. |
3141 FAIRVIEW PARK DRIVE, SUITE 500 |
FALLS CHURCH, VA 22042 |
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