Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/27/2018
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Application #:
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13913183
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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04/14/2016
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Inventors:
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Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Jun Lu
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Title:
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SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET CHIP AND A MULTI-BASED DIE PADDLE WITH TOP SURFACE GROOVE-DIVIDED MULTIPLE CONNECTING AREAS FOR CONNECTION TO THE FLIPPED MOSFET ELECTRODES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475 OAKMEAD PKWY, |
| SUNNYVALE, CALIFORNIA 94085 |
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| CHEIN-HWA S. TSAO |
| 6684 MT PAKRON DRIVE |
| SAN JOSE, CA 95120 |
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