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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
03/20/2018
Application #:
14862435
Filing Dt:
09/23/2015
Publication #:
Pub Dt:
04/21/2016
Inventor:
Stephen B. Krasulick
Title:
MULTILEVEL TEMPLATE ASSISTED WAFER BONDING
Assignment: 1
Reel/Frame:
037369/0234Recorded: 12/28/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/16/2011
Assignee:
5600 EUBANK BOULEVARD NE
SUITE 170
ALBUQUERQUE, NEW MEXICO 87111
Correspondent:
EMILY TITUS
TWO EMBARCADERO CENTER
EIGHTH FLOOR
SAN FRANCISCO, CA 94111
Assignment: 2
Reel/Frame:
043926/0762Recorded: 10/23/2017Pages: 13
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/02/2017
Assignee:
406 BLACKWELL STREET
SUITE 240
DURHAM, NORTH CAROLINA 27701
Correspondent:
PACIFIC WESTERN BANK
406 BLACKWELL STREET
SUITE 240
DURHAM, NC 27701
Assignment: 3
Reel/Frame:
044751/0469Recorded: 11/22/2017Pages: 10
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/22/2017
Assignee:
7401 SNAPROLL STREET, NE
ALBUQUERQUE, NEW MEXICO 87109
Correspondent:
PACIFIC WESTERN BANK
406 BLACKWELL STREET
SUITE 240
DURHAM, NC 27701

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