Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/12/2019
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Application #:
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14889922
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Filing Dt:
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11/09/2015
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Publication #:
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Pub Dt:
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04/28/2016
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Inventors:
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Jian Wang, Yinuo Jin, Hongchao Yang, Hui Wang
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Title:
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APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLDG. 4, NO. 1690, CAI LUN ROAD |
| ZHANGJIANG HIGH-TECH PARK, PUDONG DISTRICT |
| SHANGHAI, CHINA 201203 |
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| T. CHYAU LIANG, PH.D. |
| TWO HOUSTON CENTER |
| 909 FANNIN, SUITE 3500 |
| HOUSTON, TX 77010 |
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