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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/03/2017
Application #:
14925389
Filing Dt:
10/28/2015
Publication #:
Pub Dt:
04/28/2016
Inventors:
Byung Ju CHOI, Woo Jae JEONG, Kwang Joo LEE, You Jin KYUNG, Bo Yun CHOI, Min Su JEONG
Title:
PHOTOCURABLE AND THERMOCURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST
Assignment: 1
Reel/Frame:
039835/0166Recorded: 09/22/2016Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2015
Exec Dt:
09/09/2015
Exec Dt:
09/09/2015
Exec Dt:
09/09/2015
Exec Dt:
09/09/2015
Exec Dt:
09/09/2015
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
ROTHWELL, FIGG, ERNST & MANBECK, P.C.
607 14TH STREET, N.W.
SUITE 800
WASHINGTON, DC 20005

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