Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/24/2017
|
Application #:
|
14791310
|
Filing Dt:
|
07/03/2015
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
|
Inventors:
|
CHIH-CHENG HSIEH, HSIU-WEN HSU
|
|
Title:
|
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 12F., NO.368, GONGJIAN RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
|
|
|
| 6F., NO.366, GONGJIAN RD., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN 221 |
|
|
|
|
| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
|
|
Search Results as of:
05/24/2024 12:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
