Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14901526
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Filing Dt:
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12/28/2015
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Publication #:
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Pub Dt:
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05/26/2016
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Inventors:
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Chih-Chung Liang, Steve Xin Liang, Yu-bin Lin, Chunyan Zhang, Kai Zhang
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Title:
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FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-IN-PACKAGE STRUCTURE AND PROCESSING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 78, CHANGSHAN RD. |
JIANGYIN |
JIANGSU, CHINA 214434 |
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MATTHEW H. SZALACH |
350 WEST MICHIGAN AVENUE, SUITE 330 |
KALAMAZOO, MI 49007 |
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