Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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14925787
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Filing Dt:
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10/28/2015
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Publication #:
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Pub Dt:
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06/09/2016
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Inventors:
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Yung-Cheng Lee, Yunda Wang, Ryan John Lewis, Li-Anne Liew
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Title:
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POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5429 ILLINI WAY |
BOULDER, COLORADO 80303 |
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SANDERS IP LAW |
PO BOX 1142 |
CENTERVILLE, UT 84014 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1800 GRANT STREET |
8TH FLOOR |
DENVER, COLORADO 80203 |
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SANDERS IP |
PO BOX 1142 |
CENTERVILLE, UT 84014 |
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