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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9478464
Issue Dt:
10/25/2016
Application #:
14888674
Filing Dt:
11/02/2015
Publication #:
20160163595
Pub Dt:
06/09/2016
Inventors:
Heui Gyun AHN, Yong Woon LEE, Do Young LEE, Sang Wook AHN, Huy Chan JUNG
Title:
METHOD FOR MANUFACTURING THROUGH-HOLE SILICON VIA
Assignment: 1
Reel/Frame:
036940/0141Recorded: 11/02/2015Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
AHN, HEUI GYUN
Exec Dt:
10/29/2015
AHN, SANG WOOK
Exec Dt:
10/21/2015
LEE, YONG WOON
Exec Dt:
10/26/2015
JUNG, HUY CHAN
Exec Dt:
10/21/2015
LEE, DO YOUNG
Exec Dt:
10/22/2015
Assignee:
SILICONFILE TECHNOLOGIES INC.
(SK-U TOWER, JEONGJA-DONG) 16F, 343 BEON-GIL
9, SEONGNAM-DAERO BUNDANG-GU, SEONGNAM-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
IP & T GROUP LLP
8230 LEESBURG PIKE SUITE 650
VIENNA, VA 22182
Assignment: 2
Reel/Frame:
041023/0058Recorded: 01/20/2017Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SILICONFILE TECHNOLOGIES INC.
Exec Dt:
12/22/2016
Assignee:
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
IP&T GROUP LLP
8230 LEESBURG PIKE SUITE 650
VIENNA, VA 22182

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