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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
14206199
Filing Dt:
03/12/2014
Publication #:
Pub Dt:
06/09/2016
Inventor:
Xiaowei Wang
Title:
Thermoelectric Device Fabrication Using Direct Bonding
Assignment: 1
Reel/Frame:
033000/0844Recorded: 05/30/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/03/2014
Assignee:
11 WALL STREET
WALTHAM, MASSACHUSETTS 02453
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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