Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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14852859
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Filing Dt:
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09/14/2015
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Publication #:
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Pub Dt:
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06/23/2016
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Inventors:
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Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Michael Berktold, Timothy Y. Kam et al
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Title:
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APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| MARK J. ROZMAN |
| 1616 S. VOSS ROAD, SUITE 750 |
| TROP, PRUNER & HU, P.C. |
| HOUSTON, TX 77057 |
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