Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/31/2022
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Application #:
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14581233
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Filing Dt:
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12/23/2014
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Publication #:
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Pub Dt:
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06/23/2016
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Inventors:
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Lee Han Meng@ Eugene Lee, Shu Hui Ooi, Anis Fauzi Abdul Aziz, Wei Fen, Sueann Lim
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Title:
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MAKING A FLAT NO-LEAD PACKAGE WITH EXPOSED ELECTROPLATED SIDE LEAD SURFACES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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12500 TI BOULEVARD, MS 3999 |
DALLAS, TEXAS 75243 |
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TEXAS INSTRUMENTS INCORPORATED |
P.O. BOX 655474 |
MS 3999 |
DALLAS, TX 75265 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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12500 TI BOULEVARD, M/S 3999 |
DALLAS, TEXAS 75243 |
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TEXAS INSTRUMENTS INCORPORATED |
P O BOX 655474, M/S 3999 |
DALLAS, TX 75265 |
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09/22/2024 06:57 PM
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