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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/21/2018
Application #:
14583269
Filing Dt:
12/26/2014
Publication #:
Pub Dt:
06/30/2016
Inventors:
Yuan-Chih Hsieh, Hung-Hua Lin, Wen-Chuan Tai, Hsiang-Fu Chen
Title:
Method of Selectively Removing an Anti-Stiction Layer on a Eutectic Bonding Area
Assignment: 1
Reel/Frame:
034811/0157Recorded: 01/26/2015Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/20/2015
Exec Dt:
01/21/2015
Exec Dt:
01/21/2015
Exec Dt:
01/21/2015
Assignee:
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
ESCHWEILER & ASSOCIATES, LLC.
629 EUCLID AVENUE, SUITE 1000
NATIONAL CITY BANK BUILDING
CLEVELAND, OH 44114

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