Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2017
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Application #:
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15062570
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Filing Dt:
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03/07/2016
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Publication #:
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Pub Dt:
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06/30/2016
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Inventor:
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Hsien-Wei CHEN
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Title:
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STRESS RELIEF STRUCTURES IN PACKAGE ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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