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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9871013
Issue Dt:
01/16/2018
Application #:
14584748
Filing Dt:
12/29/2014
Publication #:
20160190082
Pub Dt:
06/30/2016
Inventors:
Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu
Title:
CONTACT AREA DESIGN FOR SOLDER BONDING
Assignment: 1
Reel/Frame:
034746/0097Recorded: 01/19/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSAI, PEI-CHUN
Exec Dt:
12/24/2014
CHEN, YU-FENG
Exec Dt:
12/24/2014
KUO, TIN-HAO
Exec Dt:
12/24/2014
CHEN, CHEN-SHIEN
Exec Dt:
12/24/2014
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
043336/0355Recorded: 08/18/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TSAI, PEI-CHUN
Exec Dt:
07/14/2017
CHEN, YU-FENG
Exec Dt:
07/19/2017
KUO, TIN-HAO
Exec Dt:
07/14/2017
CHEN, CHEN-SHIEN
Exec Dt:
07/18/2017
HUANG, YU-CHIH
Exec Dt:
07/14/2017
WU, SHENG-YU
Exec Dt:
07/19/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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