Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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14668309
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Filing Dt:
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03/25/2015
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Publication #:
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Pub Dt:
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06/30/2016
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Inventor:
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Jing-En LUAN
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Title:
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WAFER LEVEL PACKAGING FOR PROXIMITY SENSOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| SEED IP LAW GROUP PLLC |
| 701 FIFTH AVE, STE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| PLAN-LES-OUATES |
| GENEVA, SWITZERLAND 1228 |
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| RAJ K. KRISHNAN |
| STMICROELECTRONICS, INC. |
| 750 CANYON DRIVE, SUITE 300 |
| COPPELL, TX 75019 |
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