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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2017
Application #:
14599366
Filing Dt:
01/16/2015
Publication #:
Pub Dt:
07/21/2016
Inventors:
Dao-Long CHEN, Ping-Feng YANG, Chang-Chi LEE, Chien-Fan CHEN
Title:
BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE HAVING THE SAME
Assignment: 1
Reel/Frame:
034740/0585Recorded: 01/16/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/08/2015
Exec Dt:
01/08/2015
Exec Dt:
01/13/2015
Exec Dt:
01/13/2015
Assignee:
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
CLIFF Z. LIU
FOLEY & LARDNER LLP
3000 K STREET N.W., SUITE 600
WASHINGTON, DC 20007-5109

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