Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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15003255
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Filing Dt:
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01/21/2016
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Publication #:
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Pub Dt:
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07/28/2016
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Inventors:
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KAI-TI CHANG, CHING-CHI YANG, HSUEH-KUO LIAO, CHUNA-JIA CHENG
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Title:
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PACKAGE STRUCTURE OF POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 31-1 XINGBANG ROAD, GUISHAN INDUSTRIAL ZONE |
| TAOYUAN CITY, TAIWAN 33370 |
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| EVAN R. WITT |
| 60 EAST SOUTH TEMPLE |
| SUITE 1800 |
| SALT LAKE CITY, UT 84111 |
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