Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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15095802
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Filing Dt:
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04/11/2016
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Publication #:
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Pub Dt:
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08/04/2016
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Inventors:
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Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
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Title:
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POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTING THICK WIRES OR STRIPS AND METHOD FOR THE PRODUCTION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUSUMER STRASSE 251 |
| FLENSBERG, GERMANY DE-24941 |
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| MARINA F. CUNNINGHAM MCCORMICK PAUDLING |
| 185 ASYLUM STREET, CITY PLACE II |
| 6495-0621WOUS-1 |
| HARTFORD, CT 06103 |
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