Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15015145
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Filing Dt:
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02/04/2016
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Publication #:
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Pub Dt:
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08/18/2016
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Inventors:
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Yi-Hung Chen, Yuan-Chin Liu
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Title:
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WAFER-LEVEL PACKAGE HAVING ASYNCHRONOUS FIFO BUFFER USED TO DEAL WITH DATA TRANSFER BETWEEN DIFFERENT DIES AND ASSOCIATED METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TOWER B, SOFTWARE RESEARCH CENTER, INFORMATION INDUSTRY BASE, NO. 622 HUANGSHAN ROAD |
HEFEI, ANHUI, CHINA |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 040011 FRAME: 0773. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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TOWER B, SOFTWARE RESEARCH CENTER, INFORMATION INDUSTRY BASE, NO. 622 HUANGSHAN ROAD |
HEFEI, ANHUI, CHINA |
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WINSTON HSU |
P.O.BOX 506 |
MERRIFIELD, VA 22116 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK |
HSINCHU CITY, TAIWAN 30078 |
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MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE SE |
SUITE 550 |
ATLANTA, GA 30339 |
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