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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/25/2016
Application #:
14624331
Filing Dt:
02/17/2015
Publication #:
Pub Dt:
08/18/2016
Inventors:
Chia-Ching CHEN, Chin-Li KAO, Hung-Jen CHANG, Tang-Yuan CHEN, Wei-Hong LAI
Title:
INTERPOSER SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATING PROCESS THEREOF
Assignment: 1
Reel/Frame:
034975/0585Recorded: 02/17/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/12/2015
Exec Dt:
02/12/2015
Exec Dt:
02/12/2015
Exec Dt:
02/12/2015
Exec Dt:
02/12/2015
Assignee:
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
FOLEY & LARDNER LLP
975 PAGE MILL RD.
PALO ALTO, CA 94303

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