Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/29/2018
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Application #:
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15147574
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Filing Dt:
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05/05/2016
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Publication #:
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Pub Dt:
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08/25/2016
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Inventors:
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Dean Wang, Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii
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Title:
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Packages with Stacked Dies and Methods of Forming the Same
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 034480 FRAME: 0435. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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SLATER MATSIL, LLP |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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09/23/2024 01:20 AM
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