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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/04/2019
Application #:
15028332
Filing Dt:
04/08/2016
Publication #:
Pub Dt:
09/01/2016
Inventors:
Wolfram Drescher, Jan Richter, Christian Beyer
Title:
Combined wafer production method with laser treatment and temperature-induced stresses
Assignment: 1
Reel/Frame:
054288/0986Recorded: 11/05/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/29/2020
Exec Dt:
06/28/2020
Exec Dt:
06/24/2020
Assignee:
MANFRED-VON-ARDENNE-RING 7
DRESDEN, GERMANY 01099
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON
1255 CRESCENT GREEN, SUITE 200
CARY, NC 27518

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