Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/11/2018
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Application #:
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15061858
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Filing Dt:
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03/04/2016
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Publication #:
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Pub Dt:
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09/15/2016
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Inventors:
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Yu-Lung HUANG, Yen-Shih HO, Shu-Ming CHANG, Tsang-Yu LIU
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Title:
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CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F., NO. 23, JILIN RD., ZHONGLI DIST. |
TAOYUAN CITY, TAIWAN 320 |
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WEN LIU |
350 S. FIGUEROA STREET, SUITE 975 |
LOS ANGELES, CA 90071 |
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09/28/2024 08:42 AM
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