Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15073672
|
Filing Dt:
|
03/18/2016
|
|
Publication #:
|
|
Pub Dt:
|
09/22/2016
| | | | |
|
Inventors:
|
Hao-Chung Lee, Chin-Hua Hung, Cheng-Wei Hung, Jui-Fu Chang, Yu-Feng Lin
|
|
Title:
|
CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.5 DALI 3RD RD., |
| TAINAN SCIENCE-BASED INDUSTRIAL PARK, |
| TAINAN CITY, TAIWAN 74144 |
|
|
|
|
| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
|
|
Search Results as of:
05/25/2024 01:37 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
