Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
12/05/2017
|
Application #:
|
15060568
|
Filing Dt:
|
03/03/2016
|
Publication #:
|
|
Pub Dt:
|
09/29/2016
| | | | |
Inventors:
|
Yuji SUGITA, Tsutomu FUKUDA, Hideki KASHIMA, Takeshi SHIMODA
|
Title:
|
BONDING STRENGTH TEST DEVICE FOR ELECTRONIC COMPONENTS AND METHOD FOR BONDING STRENGTH TEST
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
3-10, FUKUURA, KANAZAWA-KU |
YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
|
|
|
HOLTZ, HOLTZ, & VOLEK PC |
630 NINTH AVENUE |
SUITE 1010 |
NEW YORK, NY 10036-3744 |
|
|
Search Results as of:
05/13/2024 05:10 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|