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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/27/2018
Application #:
14946611
Filing Dt:
11/19/2015
Publication #:
Pub Dt:
09/29/2016
Inventor:
Jin Mo AHN
Title:
COIL-EMBEDDED INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
037094/0263Recorded: 11/19/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/09/2015
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET
WASHINGTON, DC 20001

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