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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/07/2017
Application #:
15013719
Filing Dt:
02/02/2016
Publication #:
Pub Dt:
09/29/2016
Inventor:
Eung San Cho
Title:
Semiconductor Package with Integrated Output Inductor on a Printed Circuit Board
Assignment: 1
Reel/Frame:
037649/0279Recorded: 02/02/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/19/2016
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MICHAEL FARJAMI
26522 LA ALAMEDA AVE. SUITE 360
SUITE 360
MISSION VIEJO, CA 92691

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