Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14867513
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Filing Dt:
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09/28/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Holger Klein, Nathan A. Nuttall, Michael J. Hochberg
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Title:
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PHOTONIC INTEGRATED CIRCUIT CHIP PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 171 MADISON AVENUE, SUITE 1100 |
| NEW YORK, NEW YORK 10016 |
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| STEPHEN G. RUDISILL |
| NIXON PEABODY LLP |
| 300 SOUTH RIVERSIDE PLAZA, 16TH FLOOR |
| CHICAGO, IL 60606-6613 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 171 MADISON AVENUE, SUITE 1100 |
| NEW YORK, NEW YORK 10016 |
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| STEPHEN G. RUDISILL |
| NIXON PEABODY LLP |
| 70 WEST MADISON, SUITE 3500 |
| CHICAGO, IL 60602 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KARAKAARI 7 |
| ESPOO, FINLAND 02610 |
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| NOKIA OF AMERICA CORPORATION |
| 600-700 MOUNTAIN AVENUE |
| MURRAY HILL, NJ 07974-0636 |
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